Physical
and numerical descriptions related to the heat transfer phenomenon inside the
multilayer nanomaterial of thin film are determined. The mathematical model, of
a multilayer of thin film of tin dioxide that deposits on a composite substrate
of Silicon Dioxide/Silicon, is studied and solved by two numerical techniques,
by taking into account the variability of the thermal conductivity.
The two
main interests in this study are the determination of the value of the applied
maximum temperature on the multilayer nanomaterial, and the analysis, of theeffect of the porosity medium that exists between certain layers, on the heattransfer. In plus, in order to determine our system physical parameters, the
influence of the thickness of the thin deposit film is studied and the
numerical model, which estimates these values in the hetero junction device, is
analysed.
With
the continued reduction of dimensions of technological devices, the heat
produced can be important, component failures can occur. According to NASA, 90%
of failures are due to defects and thermal interconnects, according to the USAir Force, 55% of electronic failures are due to thermal effects.
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